Our placement equipment comes with multiple modules and various types of mounting heads to adapt to the mounting requirements of components of all sizes, ranging from 0.2 mm × 0.1 mm to 74 mm × 74 mm. In addition, it can also be modularly expanded based on product characteristics and production needs to maximize manufacturing efficiency.

Our high-precision equipment can meet the printing and mounting requirements for chip components with a minimum spacing of 0.3 mm. Precise process control ensures accurate placement and soldering of devices, ensuring product quality and reliability.

Our SMT lines operate at high speeds, reaching the mounting points of over 260,000 per hour. The high mounting speed enhances manufacturing efficiency and shortens the manufacturing cycle, ensuring the timely delivery of high-quality products.

Through the use of Automated Optical Inspection (AOI) machine and X-Ray inspection machine, we implement comprehensive quality control to proactively identify and correct defects in the manufacturing process, ensuring excellent quality.